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Electroplating

Also Known As Electrodeposition

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Electroplating passes an electric current through a bath containing dissolved metal ions, depositing a thin, adherent layer of that metal onto a conductive object serving as the circuit's cathode, used to protect a base metal from corrosion, improve its appearance, or build up a precise dimension. Luigi Brugnatelli demonstrated an early laboratory version in 1805, but the process only became a practical commercial technology after George and Henry Elkington patented electroplating with gold and silver in Britain in 1840.

Facts
Core Principle
Use an electric current to move metal ions out of a solution and onto a conductive object, building a thin, controlled, adherent metal coating one layer at a time. 1
Origin Year
1840 1
Cross-Tradition Connections

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In Field

Sources
1. Electroplating (Wikipedia)
Wikipedia contributors, Wikimedia FoundationHistory section
Quote, History section
George and Henry Elkington obtained the first patents for electroplating in 1840.
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1. Electroplating (Wikipedia)
Wikipedia contributors, Wikimedia FoundationProcess section
Quote, Process section
At the cathode, the Cu2+ is reduced to metallic copper by gaining two electrons.
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1. Electroplating (Wikipedia)
Wikipedia contributors, Wikimedia Foundationlead sentence
Quote, lead sentence
Electrodeposition (electrochemical deposition or electroplating) is a material processing technology.
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